NFME(002156.CN)

中文

Introduction

Tongfu Microelectronics co., Ltd. is a sino-foreign joint-stock enterprise jointly invested by Nantong Huada Microelectronics Co., Ltd. and Fujitsu (China) Co., Ltd. and controlled by the Chinese side. Tongfu Micropower is one of the top three IC test companies in China. More than half of the world's top 10 semiconductor manufacturers are tongfu's customers.

History

The predecessor of the company, Nantong Huada Electronics Co., LTD., was established in February 1994, and was jointly invested by Nantong transistor Factory (then restructured into Nantong Huada Microelectronics Co., LTD. In January 1997) and Hong Kong Lida Co., LTD.

In May 1997, Hong Kong Lida Company transferred its equity to Huada Microelectronics and introduced Fujitsu (China) Co., Ltd. as the shareholder of Huada Electronics and renamed it As Nantong Fujitsu Microelectronics Co., LTD.

In December 2002, the company was approved by the Ministry of Foreign Trade and Economic Cooperation after the shareholding reform.

In August 2007, the company was listed on the Small and Medium-sized board of Shenzhen Stock Exchange.

In November 2016, it was renamed "TongFu Microelectronics Co.,Ltd.".

Business

The main business of Tonfu Micropower is integrated circuit packaging and testing. Tunfu Micro Electronics is equipped with Bumping, WLCSP, FC, BGA and SiP and other advanced Bumping and testing technologies, and traditional Bumping and testing technologies like QFN, QFP and SO, as well as Bumping and testing technologies around automobile electronic products and MEMS. And wafer testing, system testing and other testing techniques.

The company is the first in China to realize the full-process after-process production of 12-inch 28nm mobile phone processor chips, including Bumping, CP, FC, FT, SLT and around.

Tongfu Micropower is one of the top three IC closed test companies in China. More than half of the world's top 10 semiconductor manufacturers are customers of Tongfu Micropower. In 2017, the global closed test company revenue ranked 7th and the third in China.

Among the local test companies in China, Tonfaw is the first to realize the full-process after-process production of 12-inch 28nm mobile phone processor chips, including Bumping, CP, FC, FT, SLT and around. The company's products and technologies are applied to high-end processor chips (CPU, GPU), memory, information terminals, Internet of Things, power modules, automotive electronics and other cloud, tube and terminal fields facing the era of intelligence.

In 2015, Tonfu Micropower invested about us $370 million to acquire 85% stake in AMD's Suzhou plant and Penang Plant in Malaysia. The two factories are mainly engaged in the high-end integrated circuit (IC) closed beta business. Their main products include CPU, GPU, APU and GamingConsole Echip.

惠博普 东风汽车 银轮股份 东北制药 津膜科技 淮北矿业 花园生物